Semiconductor Packaging News
Crazy Horse and his warriors - outnumbered, low on ammunition and forced to use outdated weapons to defend themselves - fight their final losing battle against the U.S. Cavalry in Montana.
Semiconductor Packaging News
In 2025, the semiconductor market is set for growth, with analysts projecting a 20% increase as demand rebounds from recent declines. Despite geopolitical and economic uncertainties, the long-term outlook remains positive across key sectors, driven by demand from emerging markets within the Internet of Things (IoT) framework. ...
Semiconductor Packaging News
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain.
Semiconductor Packaging News
TSMC Starts Equipment Installation for 2nm Fab TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips.
Semiconductor Packaging News Index
VIEWPOINT 2025: Dan Brewer, Co-CEO, Brewer Science As we enter 2025, what excites me most is the power of our people. Being both Certified Employee-Owned and a ...
Semiconductor Packaging News
Three years on: Has India found its footing in the semiconductor industry? India launched an ambitious push into the global semiconductor industry on December 15, three years ago, aiming to break a seven-decade struggle.
Eighteen New Semiconductor Fabs to Start Construction in 2025
4 days ago · The semiconductor industry will initiate 18 new fab construction projects in 2025, focusing on advanced logic and memory technologies. Driven by generative AI and automotive demand, capacity is forecast to grow 6.6% annually, surpassing 33 million wafers monthly ...
Semiconductor Packaging News
U.S. launches new probe into legacy Chinese chips as tech pressure on Beijing escalates The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing non-market practices that harm competition and create supply chain risks.
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies: Summary The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S.
Samsung automating semiconductor packaging, doubling efficiency
Samsung accelerates IC manufacturing with advanced packaging automation, aiming to enhance production efficiency. The tech giant has announced plans to implement cutting-edge automation technologies in its chip manufacturing process, streamlining operations and reducing human intervention. This move ...