According to the latest rumors, Qualcomm could adopt Apple’s chipset strategy and offer two variants of the Snapdragon 8 ...

Taiwan Semiconductor sharpens nanosheet roadmap with N2, N2P, and A16 nodes to power future AI and HPC demand.

The next generation of Qualcomm’s flagship mobile processor, reportedly the Snapdragon 8 Elite Gen 3 (SM8950), may launch in ...

Qualcomm is reportedly adopting a dual-version strategy for its third-gen Snapdragon 8 Elite chipset (2026 flagship) to offset the rising costs of TSMC’s ...

AMD has unveiled its latest Instinct MI350 series GPUs designed specifically for data center AI tasks. These new GPUs use the CDNA 4 architecture and are built mostly on TSMC’s cutting-edge 3nm ...

AMD confirms its next-gen Zen 6-based EPYC 'Venice' CPUs will have 256 cores in 2026, while Zen 7-based EPYC 'Verano' launches with Instinct MI500 in 2027.

Nvidia, the global leader in AI chip design, is reportedly deepening its partnership with Samsung Electronics, one of the ...

AMD’s Zen 6-based EPYC ‘Venice’ CPU pushes core count to 256, boosts performance by 70%, and features PCIe 6.0, 1.6 TB/s ...

Samsung targets 50% yield on Exynos 2600 as 2nm GAA process advances; risk production set for year-end ahead of Galaxy S26 ...

Micron has become the first DRAM vendor to begin sampling 36GB HBM4 memory with a 2048-bit interface and 2TB/s bandwidth.

The University of Tokyo (UTokyo) and Taiwan Semiconductor Manufacturing Co (NYSE:TSM) announced on Thursday that they have ...

The company is advancing key ecosystem collaborations to facilitate groundbreaking technologies, using D2D-based open chiplet interoperability to drive a broader AI connectivity platform for the ...