We wire bond one layer, inspect, rework, wire bond the second layer, repeat, etc. And it’s virtually impossible to rework layers once you have layers on top.” The more layers, the more difficult.

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

SANTA CLARA, Calif. — Chip-packaging giant Advanced Semiconductor Engineering Inc. (ASE) today unveiled a new wire bonding technique that reduces the die size but increases I/O for complex chips.

Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.

This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD ...

Featuring a resin-moulded structure, together with wire-bonding compatibility, this allows for highly flexible installation directly on the PCB and in close proximity to power semiconductor components ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets ...

“Through his innovation with my father, they introduced the first manual and automatic wire bonders, which opened the doors to the manufacture of more advanced IC technology.” Born November 2, 1920, ...