Defining Flip Chip Technology Okay, so what is flip chip wire bond technology? Basically, instead of connecting a microchip to its package using wires that go from the side of the chip to the package ...

Unlike traditional packages requiring phosphor dispensing and plastic molding, Samsung’s technology achieves chip-scale packaging without molds, enabling more compact lighting fixture designs. This ...

Production-ready Synopsys digital and analog EDA flows for Intel 18A and Intel 18A-P technologies pave the way for broad adoption and accelerate development of high-performance designs; engaged in ...

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering or probe needles Keysight fixture enables quick, repeated test without ...

The most advanced makers of semiconductor packages use plasma to improve yield and reliability, especially when using advanced materials and package sizes decrease. Chip manufacturers rely on plasma ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process. The Electrical Structural Tester empowers chip manufacturers to enhance ...

Within the package or module, a chip-to-chip interconnect is formed with hybrid bonding to deliver the highest bandwidth with low latency.

Just like it says "on the tin," wafer-level chip-scale packaging (WLCSP) is a technology that shrinks the substrate down to a size quite close to that of the actual silicon, gallium arsenide or ...

Just like it says "on the tin," wafer-level chip-scale packaging (WLCSP) is a technology that shrinks the substrate down to a size quite close to that of the actual silicon, gallium arsenide or ...

A plastic wire bonded Chip Scale Package (CSP) has been designed, fabricated and characterised for RF and high-speed digital applications. Novel ground plane design and optimised interconnect ...