SANTA CLARA, Calif. — Chip-packaging giant Advanced Semiconductor Engineering Inc. (ASE) today unveiled a new wire bonding technique that reduces the die size but increases I/O for complex chips.

Wire bonders are being used for more complex packages. These systems are pushing the limits of technology in memory ... (Power Modules and Discrete Packages). I am interested in your view and opinion ...

Uniquify, a leading high-performance semiconductor intellectual property and system-on-chip integration and manufacturing services supplier, today announced that it has achieved an ultrafast DDR3 ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Apache Design Solutions, the technology leader in power integrity and noise closure for chip-package-systems (CPS) convergence, today announced that ASE Inc ...

However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages.

WHO: Uniquify, a leading high-performance semiconductor intellectual property (IP) and system-on-chip (SoC) integration and manufacturing services supplier WHAT: At the China Semiconductor Industry ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond ...

Transforming wire bond defect screening for microelectronics. Wire bonding is pivotal in microelectronics, and with market growth projections soaring, the need for efficient testing methods is greater ...

Skyworks Solutions, Inc. (Nasdaq: SWKS), and Sequans Communications S.A. (NYSE: SQNS), today introduced the SKY66431, a 5G Massive IoT SiP (system-in- ...

Image of laser and Xe light irradiation (Graphic: Business Wire) Achieving Cleanliness and High Productivity through New Technology TOKYO, September 19, 2024--(BUSINESS WIRE)--Resonac Corporation ...