News

Private equity firm ZMC has announced via press release that it has acquired a controlling stake in Pure Wafer, the largest semiconductor silicon solutions and services company in the United States.
Pure Wafer, America’s market leading supplier of reclaimed silicon wafers, thin film deposition, and parts cleaning services to the global semiconductor manufacturing industry announced today ...
The partners have agreed on a six-month detailed roadmap to build the foundations of a groundbreaking innovation for the semiconductor industry. The solution aims to significantly improve wafer ...
--ACM Research, Inc., a leading supplier of wafer cleaning technologies for advanced semiconductor devices, today announced that it has delivered an Ultra C SAPS II tool for R&D to a leading ...
A breakthrough in next-generation semiconductor technology has been announced by Chinese researchers, with the creation of the world's largest N-polar gallium nitride (GaN) wafer, at eight inches ...
Tanaka Precious Metals: Electroplating Engineers of Japan Launched Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating Equivalent to Mass ...
Imec, a world-leading nanoelectronics research center and JSR, a leading materials company, announce that they have successfully used JSR's innovative PA (Photo-patternable Adhesive) material for ...
The U.S. Commerce Department said on Wednesday it planned to award Taiwan's GlobalWafers up to $400 million in government grants to significantly increase production of silicon wafers.
Tianjin-based wafer manufacturer Zhonghuan Semiconductor has launched a super-sized product 75% larger than conventional G1 wafers which it says, in an optimal technology format, could produce ...
Taiwan has largely focused on front-end wafer fabrication of power MOSFET and other types of power semiconductor devices while China-based firms take over mid-stage and backend processes.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to ...