SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection ...

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt.

New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.