The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...

May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Renesas Electronics Corporation introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that ...

The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and ...

Circuits Integrated Hellas (CIH), an Athens-based satcoms technology company, has launched what is thought to be the first ...

Renesas offers a wide variety of HMI solutions ranging from the 32-bit RX and RA MCU families to the 64-bit RZ family supporting 4K displays. The RZ/A series, built on RTOS-based MPUs with fast ...

Renesas introduced a new high-performance MPU in the RTOS-based RZ/A series for advanced human-machine interface (HMI) ...

An npm package named 'rand-user-agent' has been compromised in a supply chain attack to inject obfuscated code that activates a remote access trojan (RAT) on the user's system. The 'rand-user ...

As of early 2025, it appears that the major roadblock to 448G implementation is the PCB or package design. At the most recent SNIA/SFF forum on 400G links for Ethernet channels, I was asked to speak ...