News

Semiconductor Engineering6h
Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
CIE – Components in Electronics1d
Renesas extends RZ/A MPU line-up with RZ/A3M for cost-sensitive, advanced HMI solutions
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced a new high-performance ...
IEEE4d
Modeling, Design, and Characterization of Multiturn Bondwire Inductors With Ferrite Epoxy Glob Cores for Power Supply System-on-Chip or System-in-Package Applications
or system-in-package (PSiP). Improvement in total inductance and Q factor is demonstrated for the multiturn bondwire inductors due to the coupling effect. An empirical calculation method is developed ...
Design-Reuse6d
Inapac Technology Unveils Breakthrough Solution for Integrating DRAM in System-in-Package, Multichip Applications
May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...