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IEEE10d
Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint | IEEE Conference Publication | IEEE Xplore
Lead free solder joints used in surface mount packages like ball grid array (BGA) have a great impact on the reliability of the end product. In accelerated thermal cycling (ATC) tests, cyclic ...
IEEE21d
Development of Thin-Film Liquid-Crystal-Polymer Surface-Mount Packages for --Band Applications | IEEE Journals & Magazine | IEEE Xplore
In this paper, we present the design and development of thin-film liquid-crystal-polymer (LCP) surface-mount packages for Ka-band applications. The packages are constructed using multilayer LCP films ...
Daily Express23d
Mount Etna eruption: Tourists flee volcano blast in Italy
Mount Etna, the highest active volcano in Europe, started erupting once again on June 2. Extraordinary pictures of the massive eruption emerged on Monday morning, ...