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Thermal stress-strain simulation analysis of BGA solder joint reflow soldering process - IEEE Xplore
A three-dimensional finite element analysis model of BGA components was established. Using ANSYS, this model was subjected to stress-strain finite element simulation analysis under thermal-structure ...
Mechanics of materials characterization of lead-free solder mechanical properties and stress strain curve properties are needed for applications in finite element analysis. In this study, tensile ...
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