Samsung Electronics (OTCPK:SSNLF) intends to use a chip making technology favored by rival SK Hynix as the company aims to catch up in the race to make advanced chips used for AI, Reuters reported.

By moving to the mass reflow molded underfill (MR-MUF) method, Samsung addresses these issues, signaling its readiness to meet the rising demand for high bandwidth memory (HBM) chips driven by ...

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