School of Computing and Artificial Intelligence, Southwest Jiaotong University, Chengdu 611756, Sichuan, China Artificial Intelligence Research Institute, Southwest Jiaotong University, Chengdu 611756 ...

The architectural planning and analysis workflow enables system and RTL designers to rapidly explore and capture viable ...

Abstract: Stacking of many functional chips in a 3D stack package leads to high heat dissipation. Therefore a new platform technology is required to assemble chips vertically and remove the heat ...

Faculty of Materials Science and Technology, University of Science, Ho Chi Minh City 700000, Viet Nam Center for Innovative Materials and Architectures, Ho Chi Minh City 700000, Viet Nam Vietnam ...

If you are interested in a ready-to-use 3D/BIM Viewing Ecosystem for Your Own Solution, be sure to also check out: xeokit SDK is licensed under AGPLv3, which requires that any modifications or ...

This glittering realm of star birth is the subject of a new 3D visualization derived from ... three-dimensional structure of the universe… and our place within it. Credit: James Webb Space ...

Dublin, May 07, 2025 (GLOBE NEWSWIRE) -- The "3D Protein Structure Analysis Market - A Global and Regional ... that provide start-up packages for this game-changing technology as a service.

“And now that we have this structure, perhaps we can find ways to modulate its function.” For example, compounds that target the receptor could alter how natural sugars are sensed by taste ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

Abstract: Prognostics for electronic packages is an evolving field critical to predicting the reliability and lifespan of electronic systems. This article proposes a novel “structure-aware ...