LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.

Demand is soaring for mobile device semiconductor substrates that provide maximum performance in a minimal size, such as the RF-SiP ... Cu-Post structure can quickly and efficiently release heat, ...

Lawrence Livermore National Laboratory (LLNL) researchers have developed a novel 3D printing technique that uses light to build complex structures, then cleanly dissolves the support material ...

Advancements in semiconductor fabrication technologies and chip packaging processes have been central to the explosive growth of these electronic devices. However, in today's age of artificial ...

In a major leap forward for genetic and biomedical research, scientists have developed a powerful new artificial intelligence tool that can predict the 3D shape of chromosomes inside individual ...

This is also referred to as heterogenous integration (HI), where multiple dies or chiplets are integrated into a system-in-package (SiP) design. Heterogeneously integrated SiP devices offer ...

Researchers at Purdue University have developed a computational solution to this problem named NuFold, which will model 3D RNA structures that could expedite medical discovery decades ahead of ...

A team of researchers has developed an innovative imaging platform that promises to improve our understanding of cellular structures at the nanoscale. This platform, called soTILT3D for single ...