Boeing’s engine fuel control switches, now the center of the investigation into the fatal Air India crash in June, have been scrutinized before.

Build your own (nearly) all-inclusive Hawaii vacation with the special packages offered by these family resorts.

Primit Parikh, VP of the GaN Business Division at Renesas, talks about current and future developments using GaN.

Advancements in semiconductor fabrication technologies and chip packaging processes have been central to the explosive growth of these electronic devices. However, in today's age of artificial ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

This is also referred to as heterogenous integration (HI), where multiple dies or chiplets are integrated into a system-in-package (SiP) design. Heterogeneously integrated SiP devices offer ...

Octavo Systems OSD32MP2 is a family of two System-in-Package (SiP) modules, comprised of the OSD32MP2 and OSD32MP2-PM, based on the STMicro STM32MP25 Arm Cortex-A35/M33 AI processor, DDR4 memory, and ...

OSD62x SiP combines TI AM62x processor with LPDDR4, EEPROM, PMIC, and passives into a single package Octavo Systems OSD62x is a system-in-package (SiP) combining the Texas Instruments AM62x processor ...

The focus here is mainly on 2.5D and system-in-package (SiP) 2D technologies, as that ‘s what is currently available and in the works. The main drivers for this development are attempts to expand the ...

TRACO POWER announces their new TRV 2M series of 2 Watt DC/DC in the compact SIP-9 package with reinforced isolation of 5000 VAC for medical and industrial applications. This series is designed to ...