SiPs encompasses several assembly approaches, including flip-chip and wire bond SiPs (the largest in revenue and units), followed by fan-out WLP, then embedded-die packages. “SiP give system designers ...

The "System in Package (SiP) Technology market" report analyzes important operational and performance data so one may compare them to their own business, the businesses of their clients, or the ...

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OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology. Save my User ID and Password Some subscribers prefer to save their log-in information ...

The device’s intended frequency range drives which package construction is most applicable for antenna and accompanying IC. Options include simply designing the antenna into the substrate itself (AiP) ...

USI has developed advanced electronic component failure analysis (FA) technology to meet the increasingly complex and diverse needs of SiP miniaturized products.

XP Power announced the ITX series of 6 Watt DC/DC converters encapsulated in an industry standard SIP 8-pin package measuring just 0.86 x 0.44 x 0.36 inches (21.85 x 11.1 x 9.2 mm). The ITX series ...