With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC? The answer, according to IC-Link by imec, is ...

EDA and silicon IP revenue grew 12.8% in Q1 2025, totaling $5.098 billion compared to $4.522 billion in the same period last ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading ...

Nexperia announced the addition of two 1200 V 20 A silicon carbide (SiC) Schottky diodes to its continuously expanding ...

This paper presents a 3D SIP (system in package) design of four-channel power detection and signal amplification. It used HDI (High-Density Interconnect) technol ...

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

Primit Parikh, VP of the GaN Business Division at Renesas, talks about current and future developments using GaN.

At Embedded World North America, Electropages stopped by Octavo Systems who highlighted how their System-in-Package (SiP) technology integrates processors, high-speed DDR memory, and power management ...

System in package (SiP) technology provides new development for microwave modules of improving package density and integration level. In this paper, the process flow of package-on-package (PoP) ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million gates needs a way to get all that data in and out! Early on, packages just ...