WLCSP stands for Wafer Level Chip Scale Packaging ... The DPP can also be linked to the product in the form of a QR code or an RFID or NFC chip.

That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect battles inside large, powerful chips for AI and other high-performance ...

Renesas 100-V N-channel MOSFETs leverage an improved wafer manufacturing process with split gate technology, reducing on-resistance (R DS(on)) by 30%. The REXFET-1 process also cuts total gate charge ...

So it's understandable that you want to protect yourself every chance you get. RFID (radio-frequency identification) is used in many credit cards to allow for contactless payment. Instead of swiping ...

Now there are optional alternative cost percentages for developers of solar projects that use solar cells manufactured with domestically-produced wafers to appropriately recognize cost differentials ...

Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha 410082, China ...

12-inch to account for the highest CAGR in wafer size segment during the forecast period. During the forecast period, the 12-inch segment in the RFID wafer size market is expected to grow at the ...

Growing adoption RFID technology in retail and supply chain management The increasing demand for passive RFID tags and readers, RFID-IoT-cloud integration solutions, RFID initiatives by the ...