Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

We also discussed the advantages SiP brings to the design and manufacturing of semiconductors ... WARP (Wireless Open-Access Research Platform) project. Prior to that, he spent 11 years at Texas ...

The process described above makes it possible to create a set of project- and technology-related ... a typical technology file for LTCC. Most SiP design methodologies that include integrated ...

The idea is to pave the way for automating System-in-Package (SiP) design and build using such chiplets. As mentioned, the four kits are the result of an alliance between the JEDEC Solid State ...

The Iowa Economic Development Authority (IEDA) has announced a $1.4 million Strategic Infrastructure Program (SIP) grant for the ISU College of Design’s 3D Affordable Innovative Technologies (3D AIT) ...

project to improve the predictive accuracy for System in Package (SiP) design, while reducing simulation time. By cutting manufacturing costs, the aim will be to make SiP solutions attainable for SMEs ...

SIP emerged in 2019 from an Alphabet smart city project of the same name ... its facilities are set to be based on a design that will allow them to “provide resilience and flexibility to ...