For large-size flip chip packaging, how to enhance reliability, especially under temperature cycling, remains a challenge. With large-size flip chip packaging as its research object this study ...

Investing.com-- Nvidia (NASDAQ:NVDA) will start shipping a new artificial intelligence chip in line with U.S. export controls against China in the coming months, Nikkei Asia reported over the weekend, ...

Abstract: Control of the capillary driven underfill flow process is a very important problem in flip chip technology in electronics packaging. The challenge here is to uniformly distribute fluids in ...

and high-performance computing chip testing by expanding into semiconductor packaging solutions. Save my User ID and Password Some subscribers prefer to save their log-in information so they do ...

A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS ...

KUALA LUMPUR, May 6 — Malaysia is rapidly emerging as a preferred destination for high-value investments, with Prime Minister Datuk Seri Anwar Ibrahim revealing that global semiconductor giant AMD ...