Modified atmosphere packaging (MAP) is a technique that modifies the composition of the gas inside a package to prolong the shelf life and quality of fresh produce. MAP can reduce the oxygen level ...

These metabolites, known for their stress-relief and dietary benefits, are produced in higher quantities due to metabolic shifts induced by modified atmosphere packaging (MAP). The research ...

Taiwan Semiconductor (TSM) is nearing the rollout of an advanced chip packaging mechanism to power Nvidia (NVDA) and Alphabet (GOOGL) Google’s superior artificial intelligence (AI) chips.

Taiwan Semiconductor Manufacturing Co (TSMC) is on the brink of finalizing specifications for an innovative chip packaging method designed to bolster the performance of high-power AI chips, according ...

The U.S.-China trade tensions have significantly impacted the semiconductor chip packaging market, particularly due to tariffs ranging from 10% to 25% on imported semiconductor components and ...

India’s ambitious semiconductor mission has made significant strides, with one chip fabrication unit and four testing and packaging plants already having secured government approval under its ...

Advances in packaging technology are increasingly being leveraged to address food waste, particularly in transportation, storage, and retail settings. Modified Atmosphere Packaging (MAP), for example, ...

is ramping up its advanced packaging capacity to meet the growing demand for AI chips. Save my User ID and Password Some subscribers prefer to save their log-in information so they do not have to ...