flip chip packaging has become a preferred choice. This solution provides superior thermal optimization, greater I/O density, as well as faster performance. Tech giants are integrating flip-chip ...

The collaboration includes the demonstration of inkjet printable dielectric layers for use in advanced computer and AI chip packaging solutions at this year's SEMICON® SEA in Singapore ...

TSMC to build 9 new chip and packaging factories by 2025 to meet surging global demand and expand capacity. $15.25B approved for advanced tech, 2nm chips, and global fab expansion as TSM eyes $1T ...

China leverages compute-in-memory technology to overtake HBM in AI chip development Manz AG anticipates growth in advanced packaging amid CoWoS shortage ASEH, JCET gearing up for AI biz opportunities ...

The partnership focuses on demonstrating a new inkjet printable dielectric technology for advanced computer and AI chip packaging. According to InvestingPro data, while Smartkem maintains a healthy ...

Intel's (INTC) efforts to restore the chip giant to its former glory may hinge on a new manufacturing process the company calls 18A. Short for 18 angstroms — an angstrom is equal to 0.1 ...

MediaTek introduced the newest member of its Dimensity flagship smartphone chip series on May 14, 2025, named the Dimensity 9400e. This chip features MediaTek's advanced All Big Core architecture ...

We all know that Xiaomi has been making efforts to develop its own smartphone chip. Until recently, the news existed only in leaks and rumors — but not anymore. Xiaomi has officially confirmed ...