Still, 30% of Intel's wafers coming from TSMC is a fact that has now been repeated by Intel two years in a row, so at least we can agree on that, yes? Best gaming PC: The top pre-built machines.

Intel has said it needs to be thriftier and approach production with a zero-waste model. Execs said the company must prioritize efficiency over "no wafer left behind." Intel has lost ground to ...

ORLANDO, Fla., August 09, 2024--Fonon Corporation’s laser-powered BlackStar Wafer Dicing System helps semiconductor fabricators eliminate defects, distortions, cracks and chipping during wafer ...

The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws.

Intel Corp. said it is on track to produce microprocessors on 450 mm silicon wafers after a major supplier, ASML, said it would stop developing the machines needed for the move to the larger wafers.

Laser ablation dicing technology is specifically designed for ultra-thin wafer sawing, addressing limitations associated with blade dicing, such as side wall chipping.

Intel is facing another setback with the news that new wafers — foot-wide discs on which microchips are printed - were delivered to Broadcom for testing last month. Here's what Broadcom ...

Intel today signed a letter of intent with Rockwell International to buy a vacant wafer manufacturing facility in the Colorado Springs, Colo., area in order to quickly boost its manufacturing ...