We know the Surface Neo will use the mysterious Intel Lakefield chip, but that’s about it. We don’t know what two screens will do to battery life.

When Intel launched Lakefield back in June 2020, it felt like the beginning of something new. ARM may have deployed big.Little a decade ago, but Intel and AMD had previously stuck to multi-core ...

Intel listed the Lakefield Core i3-L13G4 and the Core i5-L16G7 at $281, the same customer recommended price as the Tiger Lake Core i3-1125G4. The price also included the cost of memory, ...

Intel though said they will still be accepting fresh orders for the Lakefield processors. Manufacturers have time till October 22 to place their final orders which are then going to be delivered ...

Later this year Intel plans to launch its first Alder Lake mobile processors designed to combine two different CPU architectures on a single chip. The idea is to deliver up to a 14-core processor ...

Intel discontinued its Lakefield series of processors. CPUs from the Lakefield series power thin and light devices such as the Surface Neo, Lenovo X1 Fold, and a model of the Galaxy Book S.

Intel Lakefield And Qualcomm Snapdragon 8cx Doing Battle In The Benchmarks. This sort of hybrid processor with a low number of beefy cores and a higher count of high-efficiency cores is an area ...

The latest Samsung Galaxy Book S marks a new chapter in the story of ultraportable laptops – it's the first device to appear with Intel's new Lakefield processor, a hybrid chip designed to ...

Intel Unveils Lakefield CPU Specifications: Up to 3GHz, 64 EUs, and 7W TDP Intel Shares New Data on Lakefield’s Low-Power Tremont Microarchitecture Intel Uses New Foveros 3D Chip-Stacking to ...

Intel has launched the Lakefield Hybrid processors with Samsung quick to embrace it with the Galaxy Book S. Essentially, Intel core processors with Intel Hybrid Technology provide full Windows 10 ...

Last week Intel announced Lakefield, the driver that comes along with the platform now however holds a couple of interesting entries, among them DG1, which is assumed to be the first installment ...

Intel is sharpening its Jenga skills by stacking multiple chips onto a single package. Its new Lakefield hybrid processor announced June 10 stacks multiple layers on top of one another to save ...