Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

Infineon introduces rad-hard GaN transistors, including one of the first DLA JANs-certified GaN devices, for space applications.

Infineon Technologies AG today introduced an ultra-small plastic packaging technology that it said consumes only 20% the space of a standard SC-75 package. The Thin Small Leadless Package is targeted ...

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

The first barometric sensor from Infineon for the consumer ... tiny 2×2.5×0.9mm HLGA molded package. The report presents a detailed analysis of the sensor's structure and cost.

Infineon uses carbon nanotubes to send Mosfet structure into power Steve Bush Researchers at Infineon Technologies have used carbon nanotubes to make a Mosfet structure suitable for power applications ...

This package has no wire bonding to ... C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers. The report includes a complete physical analysis ...

7th generation Superjunction MOSFET The CoolMOS C7 from Infineon is the 7th generation high-voltage Superjunction structure power MOSFET. With a breakdown voltage of 650V for a current of 7A (100 ...

Infineon Technologies has expanded its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package. The 62mm device is designed in half-bridge topology and is based on the ...