Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

the HybridPACK DC6i. This six pack module combines Infineon’s established EDT2 IGBTs with package technologies for compactness, improved thermal management at reduced material cost, and is ...

Infineon has introduced the new TO-Leadless package for its power semiconductor devices in the current range of 300 Amperes. TO-Leadless package offers less package resistance and smaller size and ...

This six-pack module, aimed at hybrid and small battery electric vehicles, combines the company’s EDT2 IGBTs with package ... Within Infineon’s portfolio, the HybridPACK DC6i is positioned ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of ...

has announced the addition of the "Infineon EWLP Package Reverse Costing" report to their offering. The First Reverse Analysis Report of a Fan-out Wafer Level Package! This report is a reverse ...