Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging G2 technology, these devices enable faster switching and lower power losses ...

SAN MATEO, Calif. — Anticipating that DSL chip vendors will be able to soon get over the compatibility hump, Infineon Technologies AG is preparing to roll out a chip set for symmetrical high-bit-rate ...

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...

This report is a reverse-costing report of the enhanced Wafer Level BGA (eWLB) package used in the X-GOLD 213 circuit from Infineon, the first fan-out wafer level package in production.

Infineon has unveiled its latest Thin-TOLL 8x8 and TOLT packages. These cutting-edge solutions optimise space on circuit boards and enhance heat dissipation, making them ideal for a wide range of ...

DrBlade from Infineon Technologies AG is reportedly t he first integrated DC/DC driver and MOSFET VR power stage implemented in an innovative chip-embedded package technology. DrBlade contains the ...

Infineon Technologies has expanded its CoolSiC 1200 V and 2000 V MOSFET module families with a new industry-standard package. The 62mm device is designed in half-bridge topology and is based on the ...

CDIL partners with Infineon Technologies to package semiconductors in India The companies’ collaboration will ensure a cost-optimised, locally integrated supply chain, providing customers with ...

The European Commission (EC) has approved a €920 million ($964m) funding package to support the construction of Infineon’s new chip fab in Dresden, Germany. The funding will allow the German chipmaker ...