The eligibility criteria for Animation courses after 12th require candidates to have completed their 10+2 education in any ...

Less design flexibility: each change requires a new mold. – Limited internal design: no way to match 3D printing’s lattice-style designs. Here’s where it gets interesting. Both 3D printing ...

Discover the future of home design with digital transformation at your fingertips. With innovative tools and user-friendly platforms, anyone can create stunning, realistic 3D models of their dream ...

Discover the best jewellery design courses in Kolkata with expert training, hands-on experience, professional certification, ...

GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet ...

A list of the top 10 best adobe illustrator plugins for designers, artists, graphic designers and photographers. Follow the blog for more Inspiration. Plugins can help you improve your workflow and ...

New Firefly-powered Offerings The Firefly Video Model (beta) extends Adobe’s family of generative AI models, which already includes an Image Model, Vector Model and Design Model, making Firefly ...

Adobe has added a bunch of new AI “quick actions” that automatically apply effects for retouching backgrounds ... Project Neo — an Illustrator-like app for 3D design that was teased last ...

New features include 'Distraction Removal,' which makes it easy to remove unwanted backgrounds ... vector format in Illustrator Illustrator, an editing software for design and layout creation ...

2.5D layouts connect multiple die on an interposer; 3D IC designs stack multiple layers of chiplets, potentially from different process nodes, into a single, cohesive package (Figure 1).

New Firefly-enabled features like Generative Shape Fill in Illustrator along with the Dimension ... creators to make complex edits and unique designs ...

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys ...