Rohm has developed new 4-in-1 and 6-in-1 SiC muolded modules in the HSDIP20 package optimised for PFC and LLC converters in ...

OKI Circuit Technology ("OTC"; President: Masaya Suzuki; Head office: Tsuruoka City, Yamagata), the OKI Group printed circuit ...

Attempts to boost power density become a juggling act to get the most functionality into the least space while managing thermal issues, reliability, and EMI.

The MCPF1412 power module with integrated I2C and PMBus® interfaces for flexible configuration and monitoringCHANDLER, Ariz., ...

In an era dominated by digital transformation, consumer electronics have become essential companions in our daily lives. From ...

- Compact, High-heat-dissipation Design Sets New Standard for OBC - ...

It has been two years since Pres. Joe Biden issued Presidential Determination 2023-06, which invoked the Defense Production ...

Igor's Lab has discovered extremely high hotspot temperatures on most (if not all) RTX 50-series AIB partner cards around the ...

The PCB design software market is expected to expand at a high growth rate from 2025 to 2035 with the development of high-end ...

Hommer Zhao, Owner of OurPCB, shared insights on the development of aluminium PCBs: "As electronic devices become more powerful, managing heat dissipation has become increasingly important. Aluminium ...

These five fast-growing companies are projected to grow revenues by over 50%, backed by structural tailwinds and sectoral demand.