News

Semiconductor Engineering11h
Addressing Stress In Heterogeneous 3D-IC Designs
Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.
Semiconductor Engineering11h
Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly
The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
IEEE3d
3D Heterogeneous Integration (3DHI): An Enabler For Next Generation RF Systems
program, thermal management of high-power density and 3D electronics (THREADS and MiniTherms3D) and 3DHI at the transistor level being explored under the Heterogeneous Heterostructures (H2) and ...
C&EN3d
Interfacial Energies for Heterogeneous Nucleation of Calcium Carbonate on Mica and Quartz
Article Views are the COUNTER-compliant sum of full text article downloads since November 2008 (both PDF and HTML) across all institutions and individuals. These metrics are regularly updated to ...
IEEE5d
A Distributed Interference Alignment Approach Based on Grouping in Heterogeneous Network
Abstract: To effectively mitigate interference and improve the performance, we propose a grouping-based two-stage distributed interference alignment (GTDIA) scheme for a two-layered heterogeneous ...
C&EN6d
Preparation of Monolithic Polymer Columns with Homogeneous Structure via Photoinitiated Thiol-yne Click Polymerization and Their Application in Separation of Small Molecules
† Key Laboratory of Separation Science for Analytical Chemistry, Dalian Institute of Chemical Physics, Chinese Academy of Sciences, Dalian, Liaoning 116023, China ‡ University of Chinese Academy of ...