This is because glass substrates for now only seem to be really beneficial for big, multi-chip packages. While AMD's all for chiplet designs in its gaming processors, it will probably make more ...

German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate ...

are another integral component of advanced chip packages. Unlike main glass core substrates, these will continue to use organic dielectric materials and copper; only this time, they will be ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

The use of glass interposers instead of silicon could help Samsung cut production costs while offering more powerful AI chips ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep ® X500 panel-level packaging lithography ...