Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits ...

Data centers are increasingly straining under artificial intelligence (AI)-fueled data loads that are over powering the ...

CircupositTM SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced ...

Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

In order to enable the further uptake of flip-chip technology, new materials and methods for substrate manufacture are required. Glass as a substrate material offers a number of potential advantages ...