Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

Samsung will replace silicon with glass in a key component of its AI chips, improving performance and efficiency.

According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

This collaboration will enable high throughput quality control of glass substrates and glass interposers ... macro defect inspection of wafers and packages, metal interconnect composition, factory ...

TASMIT aims to supply the large glass substrate inspection system to manufacturers of advanced ... has led to larger semiconductor chips and a higher number of chips per package due to greater ...

TASMIT Inc. has released a new inspection system for glass substrates as part of its INSPECTRA series ... has led to larger semiconductor chips and a higher number of chips per package due to greater ...

SKC will showcase glass substrates at the Mobile World Congress 2025 (MWC 2025), the world's largest mobile exhibition, held from Mar. 3 to 6 (local time). SKC will display glass substrates in ...

TASMIT aims to supply the large glass substrate inspection system to manufacturers of advanced ... has led to larger semiconductor chips and a higher number of chips per package due to greater ...