According to Etnews, Samsung is preparing for the future semiconductor market and plans to introduce glass substrates to improve packaging. This can be done by replacing Silicon interposers with Glass ...

Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world ...

Samsung will replace silicon with glass in a key component of its AI chips, improving performance and efficiency.

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

Data centers are increasingly straining under artificial intelligence (AI)-fueled data loads that are over powering the ...

Glass substrates will replace traditional organic ... focus for ultra-dense interconnects in advanced system-in-packages, whereas superior thermal and mechanical stability makes them more reliable ...

TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market ...

STMicroelectronics has released a set of antenna-matching companion chips for STM32WL33 wireless microcontrollers (MCUs) to ...

ST offers three antenna-matching chips for STM32WL33 MCUs to simplify development of IoT, smart metering, and remote ...

Mosaic Microsystems and NHanced Semiconductors are latest to join Siemens’ initiative to build secure domestic semiconductor ...

CircupositTM SAP8000 electroless copper is an innovative metallization technology designed for AI server CPU and GPU chip applications. This ionic base catalyst process is optimized for advanced ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the ...