Glass substrates possess superior mechanical, physical and optical properties that allow for more transistors to be connected in a package, providing better scaling and enabling assembly of larger ...

This timeline aligns with Intel’s ambitious goal of delivering 1 trillion transistors on a package by 2030. The introduction of glass substrates is a critical component of this strategy, as it ...

Intel projects that glass substrates will first target applications that utilize chiplets and large format factor packages. This includes data-center applications where high-density system-on-chip ...

Intel said glass substrates will initially be reserved for applications that require larger form factor packages, like those involving graphics, data centers, and artificial intelligence.

Intel has announced a novel glass substrate designed for “next-generation advanced packaging, planned for the latter part of this decade.” The company adds that the technology “will enable the ...

Thanks to this development, Intel's chip architectures will be able to use more chiplets in a smaller footprint on a single package, and it also will allow drastically-improved performance for the ...

Glass could support larger packages, have better thermal stability, and have ultra-low flatness for improved depth of focus for lithography. They could allow for a 10× increase in interconnect ...

With these capabilities, the company claims glass substrates will also lead to a ten-fold increase in interconnect density, as well as allow for "ultra-large form-factor packages with very high ...

C hip and substrate fabrication might not be the most exciting topic in the world, but when it could lead to significant performance and efficiency improvements, you'd better bet I'm here for it ...

Samsung and Intel aren't the only companies working on the next generation of substrate technology. Japanese manufacturer Ibiden has also joined the R&D effort for glass-based designs, while South ...

Intel has announced a novel glass substrate designed for “next-generation advanced packaging, planned for the latter part of this decade.” The company adds that the technology “will enable the ...