But the Icepi Zero stands out for a few reasons. The biggest is that instead of an ARM or RISC-V based processor, it’s ...

See all 100 here. Aiming to break bandwidth bottlenecks in high-performance systems, Altera has unveiled what the company claims to be the industry's first heterogeneous System-in-Package (SiP) ...

The first step involves placing a stand-alone FPGA onto the same package as a Xeon processor. After that, the Xeon processor and the FPGA would be fused together onto a single piece of silicon.

However, they usually come in QFP or BGA packages that are altogether difficult for hobbyists to play with. The DIP-FPGA breakout board aims to solve that problem by using a carrier PCB to put an ...

He’s creating a version of the Raspberry Pi based on a chip that combines a fast ARM processor and an FPGA in one small package. It’s called the ZynqBerry and will, assuredly, become one of ...

Emerging FPGA Analytics Market Delivers New Packages March 30, 2015 ...

Figure 1 depicts one corner of an FPGA package. The figure shows the balls on the bottom side of the FPGA as they would appear from underneath the package. You could never see this view in a real ...

Lattice has added a 132bga packaging option for its LatticeXP2 fpga range. Qualified for automotive use, the package will be targeted at space constrained applications such as camera modules, parking ...

The InFO package, measuring 11.5 × 9.5 mm ... The ZU1 has been designed to use 40% less power than the ZU2, but the FPGA fabric size is only 20% less than the ZU2. It’s possible to power ...

The “USM Universal Submodule” concept is leading the way to a new generation of M-Modules and PMCs that implement the desired functionality through an IP core in an FPGA. With the help of a ...

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...