News
The promise of a new type of computer chip that could reshape the future of artificial intelligence and be more ...
Volantis, a startup company in San Mateo, California, says it has attracted seed funding of $9 million to help it develop photonic interconnects based around densely parallel optical waveguides.
A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure ...
Advanced Micro Devices Inc.'s stock climbed nearly 9% on Monday as investors remain optimistic about its upcoming artificial-intelligence chips and systems that were unveiled last week - perhaps more ...
The PHLX Semiconductor Index is up about 6% so far this year - doubling the gains seen for the S&P 500 - and several big chip stocks look poised for more gains on continued artificial-intelligence ...
Opinion: The foundry makes all of the logic chips critical for AI data centers, and might do so for years to come.
Press Release Volantis, a semiconductor startup building photonically integrated computers for the AI era, today emerged from stealth and announced a $9 million seed round of funding. The round ...
The new group is part of an ambitious, and costly, effort by Meta CEO Mark Zuckerberg to gain ground on rivals like Google ...
9d
IEEE Spectrum on MSNIntel Upgrades Chip Packaging for Bigger AIThis week at the IEEE Electronic Components and Packaging Technology Conference, Intel unveiled that it is developing new ...
Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.
A co-design flow of packaging and ASIC design allows customers to evaluate and balance the many factors at play. A co-design flow also helps ensure that the final product delivers the required ...
18d
Tom's Hardware on MSNIntel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidthIntel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results