Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI ...

Siemens Digital Industries Software have introduced two new solutions to its Electronic Design Automation (EDA) portfolio ...

First, the company’s Innovator3D IC suite enables chip designers to efficiently author, simulate, and manage heterogeneously ...

Power Integrations, a developer of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has ...

During the solder reflow process thermal stresses are induced in a plastic-encapsulated IC package due to the mismatch of coefficient of thermal expansion (CTE) between the plastic encapsulant, the ...

The FX Pack is just an appearance package and involves no interference with the engine. This means that the cars are set in motion by the 5.0-liter Coyote V8, which produces 480 horsepower and 418 ...

Kyocera’s ceramic package business is a highly competitive business with approximately 80% global market share and thus has been the source of the company's rich cash flow and healthy balance sheet.

In order to reduce stress in the plastic small outline J-lead (SOJ) package and prevent the interface delamination under the infrared (IR) soldering process, parameterization, parametric study and ...