Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI ...

Siemens Digital Industries Software have introduced two new solutions to its Electronic Design Automation (EDA) portfolio ...

Power Integrations, a developer of high-voltage integrated circuits (ICs) for energy-efficient power conversion, has ...

A novel concept to implement an antenna on an integrated circuit package is proposed for the single-chip solution of a wireless transceiver using deep submicron CMOS technology. The prototype antenna ...

Voltage-Reference IC with Integral Heater Offers Single PPM-Class Results. April 10, 2024. ... Thanks to this surface-mount ceramic package, ...

Research into using glass substrates for chipmaking is nothing new. As Intel’s release says, the company has been working on this technology for at least a decade, as have other organizations ...