News

First, the company’s Innovator3D IC suite enables chip designers to efficiently author, simulate, and manage heterogeneously ...
This innovative bi-layered coating offers superior fire resistance, with a 320-µm thickness providing over 900 seconds of ...
Siemens Digital Industries Software have introduced two new solutions to its Electronic Design Automation (EDA) portfolio ...
Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI ...