Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group ...

Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group from Nagoya University ...

Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, ...

EV Group (EVG), a provider of semiconductor integration and process solutions, has topped the rankings in the 2025 ...

CNW/ - Twenty-three recipients representing twenty projects of the first round of FABrIC Challenge Projects were announced today. Leveraging $35.6M in total investment, the $13.4M in funding provided ...

Packaging had some well attended Special Sessions at the 75th ECTC of which these three were particularly popular: 1.Advanced ...

Gallium nitride, a semiconductor renowned for its efficiency and high-speed capabilities, has long been recognized as a ...

The interest in the wafer-scale growth of two-dimensional (2D) materials, including transition metal dichalcogenides (TMDCs), has been rising for transitioning from lab-scale devices to ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...