Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group ...

Using only a single-crystal piezoelectric thin wafer of lithium niobate (LN) instead of the usual two-part structure, a group from Nagoya University ...

EVGroup is a big player in making parts for electronics, like the ones in your phone. They help make tiny parts work better by coming up with new ideas. EVGroup is always looking for new ways to build ...

Resonac Corporation and PulseForge, Inc. are pleased to announce a strategic partnership to advance and promote photonic debonding technology for next-generation semiconductor packaging as of April, ...

EV Group (EVG), a provider of semiconductor integration and process solutions, has topped the rankings in the 2025 ...

Gallium nitride, a semiconductor renowned for its efficiency and high-speed capabilities, has long been recognized as a ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...

The low-cost, scalable technology enables seamless integration of high-speed gallium nitride transistors onto a standard ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...

A new 3D chip stacking method developed in Japan promises to revolutionize AI and high-performance computing with faster data ...

TSMC's advanced packaging tech and global expansion drive AI innovation and stock growth, despite geopolitical and capital ...