However, the collaboration between TSMC and Amkor will be more profound as the latter intends to offer TSMC’s CoWoS and InFo advanced packaging technologies for high-end AI, HPC, and mobile ...

TOKYO, March 18 (Reuters) - Taiwan's TSMC (2330.TW), opens new tab is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would ...

Utilizing TSMC’s CoWoS 2.5D silicon-interposer-based packaging, the fully integrated and highly configurable subsystem delivers a high bandwidth density of 8 Tbps/mm while optimizing I/O ...