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Integrating multiple chiplets in advanced packaging requires high-bandwidth and energy-efficient chiplet-to-chiplet interconnects. Parallel interconnects have emerged as the preferred interface for ...
A complete optical wireless interface for the ARINC 429 avionics bus has been presented as part of this paper. After evaluating the previous results, we conclude that the described system complies ...
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced the RA8P1 microcontroller ...