台积电计划在 3 月前投资超过 2000 亿新台币（约合 61.2 亿美元），扩建其位于台湾南部科学园区三期的CoWoS生产设施。知情人士透露，台积电之所以做出这一决定，是因为人工智能（AI ...

1月20日，台积电宣布斥资扩建其CoWoS先进封装厂，以巩固在AI芯片市场的领导地位。据悉，该公司计划在南科三期新建两座CoWoS封装厂，并投资超过2000 ...

导语：CoWoS是AI革命的关键推动技术，台积电正持续扩张产能。 1月20日，据台媒消息，台积电将新建两座CoWos封装厂，厂址定于台南市的南部科学园区 ...

据台媒经济日报报道，台积电冲刺CoWoS先进封装布局，最新传出又要在南科三期盖两座CoWoS新厂，投资金额估逾2,000亿元。加计台积电正在嘉科园区 ...

台积电计划在南科三期新建两座CoWoS厂，投资金额超过2000亿新台币。此举表明其高性能计算订单需求旺盛，是其在先进封装领域的重要布局。 观点网讯：1月20日，台湾半导体巨头台积电在南科三 ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an ...

图源台媒“中央社” IT之家注意到，早在 1 月 13 日，野村证券分析师郑明宗就已指出英伟达将会减少至多 80% 的采用台积电先进封装的 CoWoS-S 订单 ...

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...

尽管市场上有传言称英伟达大幅削减了对台积电CoWoS-S封装的需求，甚至有报告指出砍单幅度高达80%，但台积电和英伟达均对此进行了否认..... 近期，台积电对于被英伟达大幅削减CoWoS订单的传闻 ...