YorChip’s CTO and founder, Frank Dunlap said, “The Universal PHYTM design is optimized for power (5X) lower than UCIe-SP, ...

Partners establish commercial quantum dot epitaxial wafer supply chain for AI optical interconnects.

The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Infineon Technologies AG has achieved a milestone on the way to a quantum-resilient world in collaboration with the German ...

Siddhartha Sinha, principal member of technical staff, explains how imec has achieved seamless InP Chiplet integration on 300mm RF Silicon Interposer with excellent performance at 140GHz. Using RF ...

In addition to the announced federal funding terms announced, the $172 million project will be supported by an expected $15.7 ...

Series B funding led by Maverick Silicon fuels market expansion and ability to meet rapidly growing demand for ...

Laith Altimime, President of SEMI Europe, discusses the challenges and opportunities facing the European semiconductor ...

Stewart Randall, Global Lead for Semiconductors, Intralink’s UK-APAC Tech Growth Programme (TGP), explains how the programme ...

Part Analytics provides the electronics industry’s leading AI-powered supply chain management platform, which enables ...

Advanced packaging with glass is a crucial future technology for the semiconductor industry. Glass is significantly cheaper than silicon. This will enable manufacturers to reduce production costs and ...