Controlling the wire-bonding process is tricky — requiring high accelerations, short move and settle times, high accuracy, and high throughput. Bonding machines must weld delicate connections ...

The process begins by positioning a wire beneath the end of a slender bonding instrument. A precise force is exerted, pushing the wire against the electrode’s surface, leading to an initial ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Wire-bonding to be increasingly needed to process car-use IGBT, SiC modules, says K&S VP Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Thursday 9 September 2021 0 Chan Pin Chong, VP at K&S. Credit ...

TOKYO Tessera Inc. will become exclusive licensor of Toshiba Corp.'s wire-bonding process for the microBGA package, according to an agreement reached by the two companies. Toshiba developed the ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner ...

SANTA ROSA, Calif., August 28, 2024--Keysight Technologies, Inc. (NYSE: KEYS) introduces the Electrical Structural Tester (EST), a wire bond inspection solution for semiconductor manufacturing ...