Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

ASMPT provides investors with exposure to long-term high-growth themes such as the proliferation of semiconductors in autos and industrial “Internet of Things” as well as artificial intelligence, or ...

The company will apply this to its mobile chip substrates such as radio frequency system-in-package and flip chip chip-scale package components.

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

Cognichip’s approach is to develop a physics-informed foundation model that achieves more parallelism than is available in ...

News Business Wire Obviant Raises $7.1M in Funding to Scale its Data Intelligence Platform for Defense Acquisition, Contracting and Budgeting ...

This marks the first commercial-scale production of recycled neodymium-iron-boron (NdFeB) alloy using HPMS technology and represents a significant milestone for all stakeholders involved.

This study evaluates copper redistribution layer fusing currents in wafer-level packaging through experiments and simulations, finding that silicon thickness significantly improves heat dissipation ...