The $700 million package addresses statewide projects using money from a state bond and general fund bill. Aside from the ...

Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

In this paper, bond via array (BVA) wirebond is used to achieve compact vertical integration and improve the electrical performance for system in package (SiP). Two techniques are presented. In the ...

High-speed short-range wireless communication systems are expected to utilize the 60-GHz band. This paper presents a bonding wire loop antenna in a standard ball grid array (BGA) package for 60-GHz ...

ALPHARETTA, Ga. & INDIANAPOLIS-- (BUSINESS WIRE)-- Agilysys, Inc. (Nasdaq: AGYS), a leading global provider of hospitality software and services, today announced the launch of Agilysys Book with S ...

The New York Stock Exchange, Nasdaq, and bond markets will close early the day before Independence Day (Thursday, July 3, ...

Flip chip wire bond is a modern way to connect chips, turning them upside down for better performance. This technology makes ...

Single and Triple Channel Drivers Enhance Thermal Optimization for High-Power ApplicationsMILPITAS, Calif., July 07, 2025 (GLOBE NEWSWIRE) -- Lumissil Microsystems announces the release of the IS32LT3 ...

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Oregon lawmakers have wrapped up a 2025 session that will be remembered above all else for Democrats’ towering failure to get ...

SINGAPORE/NEW YORK (Reuters) -Global investors are heading into U.S. President Donald Trump's Wednesday deadline for trade ...