Now, a team of researchers led by Professor Huang Xian from the School of Precision Instrument and Opto-electronics ...

Conventional testing approaches face major limitations, with some methods damaging wafer surfaces irreversibly, while others ...

Fortunately, dual-purpose analyzers that combine spectrum analysis and VNA are available now, which are designed with a mix ...

The emerging wafer-level packaging (WLP) technology suffers from serious signal integrity (SI) and power integrity (PI) issues due to its redistribution layer (RDL). There exhibit serious parasitic ...

If PCBs aren’t tested, errors and defects missed during the manufacturing process could eventually lead to malfunctions and product failures in the field. After a PCB board is manufactured and ...

Bright field imaging systems are widely used for inline inspection tools to detect with high sensitivity defects on patterned wafers in semiconductor fabrication processes. We expect to extend this ...